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| CHC3014-99F_15 Datasheet, PDF (16/20 Pages) United Monolithic Semiconductors – X-band Core Chip | |||
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CHC3014-99F
Recommended assembly plan
X-band Core Chip
Note: Biasing pads 2-5-25-27 can be commonly connected to the +5V supply voltage
Bonding length recommendations
Pad name
IO (Pad 1)
TX (Pad 6)
RX (Pad 24)
All others
Description
TXin/Rxout
Txout
RXin
DC and Interface
pads
Connection
Inductance (Lbonding) = 0.3nH
Two wires: diameter 25µm, length 0.470µm
Inductance (Lbonding) = 0.8nH
One wire: diameter 25µm, length 1mm
Ref. : DSCHC3014-0293 - 20 Sep 10
16/20
Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
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