CHR3662-QDG_15 Datasheet, PDF (13/16 Pages) United Monolithic Semiconductors – 7-16GHz Integrated Down Converter

7-16GHz Down Converter
Definition of the Sij reference planes
The reference planes used for Sij
measurements given above are symmetrical
from the symmetrical axis of the package
(see drawing beside). The input and output
reference planes are located at 3.18mm
offset (input wise and output wise
respectively) from this axis. Then, the given
Sij parameters incorporate the land pattern
of the evaluation motherboard recommended
at the page 16.
CHR3662-QDG
3.18
3.18
Recommended package footprint
Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot
print recommendations.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Recommended environmental management
Refer to the application note AN0019 available at http://www.ums-gaas.com for
environmental data on UMS package products.
Ref.: DSCHR3662-QDG1192 - 11 Jul 11
13/16
Specifications subject to change without notice
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