CHC3014 Datasheet, PDF (12/16 Pages) United Monolithic Semiconductors – X-band RX-TX Core Chip GaAs Monolithic Microwave IC

CHC3014
8-12GHz RX-TX Core Chip
MMIC mechanical dimensions and pad allocation
4 965
23 45
2 735
2 535
1
2 335
27 26 25
000
105
4 470
4 900
6
4 700
4 500
7
4 235
8
4 065
9
3 895
10
3 725
11
3 555
12
3 385
3 215
3 045
13
2 875
14
2 705
2 535
2 365
15
16
17
18
19
20
21
2 195
2 025
1 855
1 685
1 515
1 345
1 175
1 005
22
835
23
570
2₂4₄
370
170
Chip thickness = 100µm +/- 10 µm.
RF pads (1, 6, 24) = 122 x 200µm²
DC and control pads (2, 3, 4, 5, 7 to 23, 25, 26, 27) = 120 x 100µm²
Pin
number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Pad
name
IO
+5R
+5
-5
+5T
TX
C1
C2
A1
A2
A3
A4
A5
A6
Description
Input/Output RF: Rxout. Txin
+5V supply voltage Amplifier 3
+5V supply voltage : interface
-5V supply voltage
+5V supply voltage Amplifier 4
Output RF: TXout
Coarse attenuator bit 1
Coarse attenuator bit 2
Attenuator bit 1
Attenuator bit 2
Attenuator bit 3
Attenuator bit 4
Attenuator bit 5
Attenuator bit 6
Pin
number
15
16
17
18
19
20
21
22
23
24
25
26
27
Pad
name
-5
SA
SB
P1
P2
P3
P4
P5
P6
RX
+5R
-5
+5
Description
-5V supply voltage: interface
Switch bit 1
Switch bit 2
Phase shifter bit 1
Phase shifter bit 2
Phase shifter bit 3
Phase shifter bit 4
Phase shifter bit 5
Phase shifter bit 6
Input RF: RXin
+5V supply voltage Amplifier 1
-5V supply voltage
+5V supply voltage Amplifier 2
Ref. : DSCHC30149043 - 12 Feb 09
12/16
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Specifications subject to change without notice