AN0024 Datasheet, PDF (1/14 Pages) United Monolithic Semiconductors – Application Note for Surface Mount Hermetic Package

AN0024
Application Note for Surface Mount Hermetic Package
FAA Type
1. FAA type package general presentation
FAA type package is ideal for application requiring enhanced reliability and electrical
performances. This surface mount square no lead package (QFN like) is fully
hermetic and is designed to operate at very high frequency above 30GHz with a very
low thermal resistance at the same time.
This package is perfectly adapted to defence and space applications and can also
be used for power devices.
Its very compact ceramic metal body with outline dimensions of 6x6 mm² is designed
to be compatible with standard automatic SMT assembly and tests industrial
equipments massively used for QFN packages.
This package includes two 50Ω accesses for millimetre-wave signals and ten
accesses for DC, control or RF signals. A large ground pad is managed at the
package’s bottom side in order to improve the electrical and thermal performances.
Top view
Bottom view
Figure 1: FAA package top and bottom views.
Main features:
Package type
Body dimensions
Package thickness
Number of millimetre-wave leads
Number of low frequency leads
Metallic ground pad surface
Package’s ground pad thermal
resistance
MSL
Hermetic sealing (fine leak compliant
Mil-Std-883 Method 1014.10 Condition
A4, tracer gas He at 1atm)
Package leads finish is gold (Au)
Solderability (Mil-Std-883 Method
2003.7, aging operation omitted)
Unit
-
mm²
mm
-
-
mm²
°C/W
-
ccHe/s/atm
µm
Typical Value
QFN
6x6
2.5
2
10
3.7 x 3.7
<0.2
1
1x10^-8
0.8 min.
Under x10 magnification, at
least 95% coverage by
continuous solder coating
Ref. : AN00242352 - 17 Dec 12
1/14
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: [phone] - Fax: [phone]