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FDN352AP Datasheet, PDF (2/2 Pages) Fairchild Semiconductor – Single P-Channel, PowerTrench
SMD Type
Product specification
FDN352AP
Electrical Characteristics TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Off Characteristics
BVDSS Drain–Source Breakdown Voltage
∆BVDSS
∆TJ
Breakdown Voltage Temperature Coefficient
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate–Body Leakage
On Characteristics
VGS = 0 V, ID = –250 µA
ID = –250 µA, Referenced to 25°C
VDS = –24 V, VGS = 0 V
VGS = ±25V, VDS = 0 V
VGS(th)
∆VGS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
gFS
Forward Transconductance
Dynamic Characteristics
VDS = VGS, ID = –250 µA
ID = –250 µA, Referenced to 25°C
VGS = –10 V, ID = –1.3 A
VGS = –4.5 V, ID = –1.1 A
VGS = –4.5 V, ID = –1.1 A, TJ = 125°C
VDS = –5 V, ID = –0.9 A
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Switching Characteristics
VDS = –15 V, VGS = 0 V, f = 1.0 MHz
td(on)
tr
Turn–On Delay Time
Turn–On Rise Time
VDD = –10 V, ID = –1 A,
VGS = –10 V, RGEN = 6 Ω
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
VDS = –10V, ID = –0.9 A,
VGS = –4.5 V
Qgd
Gate–Drain Charge
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward Voltage
VGS = 0 V, IS = –0.42 A
trr
Diode Reverse Recovery Time
Qrr
Diode Reverse Recovery Charge
IF = –3.9 A,
dIF/dt = 100 A/µs
–30
–0.8
Typ
–17
–2.0
4
150
250
330
2.0
150
40
20
4
15
10
1
1.4
0.5
0.5
–0.8
17
7
Max Units
V
mV/°C
–1
µA
±100 nA
–2.5
V
mV/°C
180 mΩ
300
400
S
pF
pF
pF
8
ns
28
ns
18
ns
2
ns
1.9 nC
nC
nC
–0.42 A
–1.2
V
ns
nC
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