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AM3531C Datasheet, PDF (1/2 Pages) Analog Power – N & P-Channel 30-V (D-S) MOSFET
These miniature surface mount MOSFETs
utilize a high cell density trench process to
provide low rDS(on) and to ensure minimal
power loss and heat dissipation. Typical
applications are DC-DC converters and
power management in portable and
battery-powered products such as
computers, printers, PCMCIA cards,
cellular and cordless telephones.
•
Low rDS(on) provides higher efficiency and
G1
extends battery life
S2
• Low thermal impedance copper leadframe G2
TSOP-6 saves board space
• Fast switching speed
• High performance trench technology
Product specification
AM3531C
PRODUCT SUMMARY
VDS (V)
rDS(on) (Ω)
30
0.058 @ VGS = 4.5V
0.082 @ VGS = 2.5V
-26.5
0.112 @ VGS = -4.5V
0.172 @ VGS = -2.5V
ID (A)
3.7
3.1
-2.7
-2.2
TSOP-6
Top View
1 6 D1
2 5 S1
3 4 D2
D1
G1
S1
N-Channel MOSFET
S2
G2
D2
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 oC UNLESS OTHERWISE NOTED)
Parame ter
Symbol N-Channel P-Channe l Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Currenta
Pulsed Drain Currentb
VDS
VGS
TA=25oC
TA=70oC
ID
IDM
30
-26.5
V
±12
±12
3.7
-2.7
2.9
-2.1
A
8
-8
Continuous Source Current (Diode Conduction)a
IS
1.05
-1.05
A
Power Dissipationa
TA=25oC
TA=70oC
PD
1.15
W
0.7
Operating Junction and Storage Temperature Range TJ, Tstg
-55 to 150
oC
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
t <= 10 sec
Steady State
Symbol
RthJA
N-Channel
Typ
Max
93
110
130
150
P-Channel
Typ
Max
93
110
130
150
Unit
oC/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature
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