SMHP Datasheet, PDF (5/6 Pages) Bi technologies – 20W TO-263 HIGH POWER SURFACE MOUNT RESISTORS

SMHP25 Series
Power Resistor
SMHP25 Series
OBSOLETE
Physical Data
G
N
Q
R
B
M
L
K
A
F
J
H
C
E
P
11.0
10.0
Case, Epoxy UL94-V0
Leads, Sn Plated Cu
Leads Joint, Solder
Resistor, Ni-Cr or RuO
Substrate, Alumina
Joint, Solder
Tab, Matte Sn Plated Cu
1.60
16.0
3.50
Insulated Between Tab and Resistor
5.08
Recommended minimum footprint dimensions.
All dimensions are in millimeters (mm).
Lead & Tab Material Tin Plated Copper
Part Weight
1.5g
Dim In (nom)
mm
A
0.398 10.1 ±0.2
B
0.406 10.3 ±0.2
C
0.177
4.5 ±0.2
E
0.197
5.0 ±1.0
F
0.098
2.5 ±0.5
G
0.087
2.2 ±0.2
H
0.108 2.75 ±0.2
J
0.020 0.5 ±0.05
K
0.030 0.75 ±0.05
L
0.059 1.5 ±0.05
M
0.200 5.08 ±0.1
N
0.059 1.5 ±0.05
P
0.291
7.4 ±0.1
Q
0.325
8.3 ±0.2
R
0.100
2.5 ±0.2
Environmental Data
Test
Load Life
Humidity
Temperature Cycle
Short Time Overload
Vibration
Insulation Resistance
Dielectric Withstanding Voltage
Resistance to Solder Heat
Solderability
Operating Temperature Range
Method
1,000 Hours @ 25°C;
90 minutes on, 30 minutes off
1000 hours; 40°C, 90-95% RH, 0.1W DC
5 cycles; 30 minutes @ -55°C, 30 minutes at +155°C
2X Rated Power, not to exceed 1.5X Rated Voltage
for 5 seconds, 25° w/ Heat Sink
10 cycles; X, Y, Z axis, amplitude 0.75mm, 100-
2000Hz sweep/min
Between terminals and tab
Terminals to tab; 60sec, 1mA
350 ± 5°C for 3 seconds
Specification - Performance
±(1.0% + 1mΩ)
±(1.0% + 1mΩ)
±(0.25% + 1mΩ)
±(0.25% + 1mΩ)
±(0.25% + 1mΩ)
>1000MΩ
2000 volts AC
±(0.10% + 1mΩ)
230 ± 5°C, 3sec.
>95% coverage
-55°C to +155°C
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
© TT electronics plc
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
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