WBC Datasheet, PDF (1/3 Pages) TT Electronics. – Discrete or tapped schematics

Resistors
Wire Bondable
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Discrete or tapped schematics
MIL inspection available
WBHCigSherreiesisstor density
• Discrete or tapped schematics
• MIL inspection available
• High resistor density
Make Possible
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil^® tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil^® resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
Electrical Data
Absolute Tolerance
to ±0.1%
R
0.020˝ ±0.001
(0.508mm ±0.025)
0.004˝ min bond pad size
B0202 - Discrete back contact
Back contact
0.020˝ ±0.001
(0.508mm ±0.025)
R
Top contact
pad chamfered
0.004˝ min bond pad size
T0303 - Tapped network ½R + ½R
Top contact
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed √ P x R )
Operating Temperature
to ±25ppm/°C
250mW
100V
-55°C to +150°C
Noise
<-30dB
Substrate Material
Substrate Thickness
Oxidized Silicon
(10KÅ SiO₂ min)
0.010˝ ±0.001
(0.254mm ±0.025)
Bond Pad
Metallization
Aluminum
Gold
10KÅ minimum
15KÅ minimum
½R
½R
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
General Note
IRC reserves the right to make changes in product specification without notice or liability.
A_Gll i_enfo_nrm_ea_rt_aio_ln _Nis s_ou_tbj_eect to IRC’s own data and is considered accurate at time of going to print.
©TTIRElCecAtrodnvicasnrceseedrvFesiltmheDriigvhitstioonma•kCeocrphuasnCgherisstiinTepxraosd7u84c1t1spUeScAification without notice or liability.
T_Ael_le_lp_inho_fone_rm: 36_a1_ti9_o9_n2 _i7_s9_s0_u0_b•_jF_ea_cc_ts_tim_oil_Te:_T36_E1_le9_c9_t2_ro3_n37_ic7_s•_’W_oe_wb_nsit_de_a: w_taww_a._nirc_dtt._ic_so_cm_{onsidered accurate at time of going to print.}
© TT Electronics plc
Backside
Passivation
R0202 and
T0303
B0202
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
www.ttelectronicsresistors.com
07.14