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SMC Datasheet, PDF (1/3 Pages) Microsemi Corporation – UNIDIRECTIONAL AND BIDIRECTIONAL SURFACE MOUNT | |||
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Resistors
Make Possible
Cylindrical Surface Mount MetalGlazeâ¢
CSoMmCpliSanetr-Tieersminal Resistors
SCMyCliSnedrireiscal Surface Mount
Metal Glazeâ¢
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⢠LeIaddefarelef,oRroaHuStcoommpolitainvte and other harsh thermal applications
⢠UsUens csotamndparrdoImRCis2in51g2,M36e1t0alsoGldlearzpeaâ¢dsperformance gives
⢠Ideeaxlcfeorllaeuntotmsoutirvgeeanpdeortfhoerrmhaarsnhctehermal applications
⢠Uncompromising Metal Glaze⢠performance gives excellent
suCragepppeerdfortmearnmceinals provide mechanical compliance-relief
⢠Cafrpopemd tberomainrdalsvpsr.ocviodme mpeocnhaennictaTl cCoEmmpliaisnmcea-rteclihef from
board vs. component TCE mismatch
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
Electrical Data
IRC
Type
Industry
Standard
Footprint
Power Rating
(Watts)
SMC-1
2512
1.0 @ 70°C
SMC-2
3610
2.0 @ 25°C
1.33 @ 70°C
Notes:
1 For tolerances below ±1%, please contact factory.
Resistance
Range
(Ohms)
1.0 to 10 Ω
⥠10 - 1 MΩ
1.0 to 10 Ω
⥠10 - 1 MΩ
Tolerance
(±%)1
5
1, 2, 5
5
1, 2, 5
TCR
(±ppm/°C)
200
100
200
100
Operating
Voltage
(V)
350
500
Maximum
Voltage
(V)
700
1000
Environmental Data
Characteristics
Temperature Coefï¬cient (ppm/°C)
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Operating Temperature
Maximum Change
As speciï¬ed
±2.0% +0.01Ω (R ⤠10Ω)
±1.0% +0.01Ω (R > 10Ω)
±1.0% +0.01Ω (R ⤠10Ω)
±0.5% +0.01Ω (R > 10Ω)
±1.0% +0.01Ω (R ⤠10Ω)
±0.5% +0.01Ω (R > 10Ω)
±1.0% +0.01Ω (R ⤠10Ω)
±0.5% +0.01Ω (R > 10Ω)
±1.0% +0.01Ω (R ⤠10Ω)
±0.5% +0.01Ω (R > 10Ω)
95% minimum coverage
±1.0% +0.01Ω (R ⤠10Ω)
±0.5% +0.01Ω (R > 10Ω)
±1.0% +0.01Ω (R ⤠10Ω)
±0.5% +0.01Ω (R > 10Ω)
±1% +0.01
no mechanical damage
±1% +0.01
no mechanical damage
Test Method
MIL-PRF-55342E Par 4.7.9
(-55°C to +125°C)
MIL-PRF-55342E Par 4.7.3
(-65°C to +150°C)
MIL-PRF-55342E Par 4.7.4
(-65°C @ working voltage)
MIL-PRF-55342E Par 4.7.5
(2.5 x âPxR for 5 seconds)
MIL-PRF-55342E Par 4.7.6
(+150°C for 100 hours)
MIL-PRF-55342E Par 4.7.7
(Reï¬ow soldered to board @ 260°C for 10 seconds)
MIL-STD-202, Method 208
(245°C for 5 seconds)
MIL-PRF-55342E Par 4.7.8
(10 cycles, total 240 hours)
MIL-PRF-55342E Par 4.7.10
(2000 hours @ 70°C intermittent)
1200 gram push from underside of
mounted chip for 60 seconds
Chip mounted in center of 90mm long board,
deï¬ected 5mm so as to exert pull on chip contacts
for 10 seconds
-55°C to +150°C
GeenneerraallNNootete
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All information is subject to TT Electronicsâ own data and is considered accurate at time of going to print.
Wire and Film Technologies Division ⢠4222 South Staples Street ⢠Corpus Christi Texas 78411 USA
T©eleTphTonEe:l3e6c1t9r9o2n7i9c0s0 â¢pFlaccsimile: 361 992 3377 ⢠Website: www.irctt.com
A subsidiary of
www.ttelectronicTsTreesleiscttorornsi.ccsopmlc
SMC Series Issue March 2010 Sheet 1 of 3
07.14
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