RGT Datasheet, PDF (1/3 Pages) TT Electronics. – Stable thick-film technology

Resistors OBSOLETE
Thick Film Temperature
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R_CGT_oSe_mries_{pensation Resistor}
Superior linearity
Stable thick-film technology
RG^NT^eS^gae^trⁱi^ve^es^{temperature coefficient}
• Su^Ep^fe^feri^cor^til^vin^eea^cr^oity^{mpensation for positive TC devices,}
• St^sa^eb^mle tⁱh^ci^ockⁿ-f^dilm^ucte^toch^rn^so^,lo^agⁿy^{d copper}
• Negative temperature coefficient
• Effective compensation for positive TC devices, semiconductors, and copper
Specifications
Make Possible
Exclusive thick film process
results in a very linear, negative,
3000 ppm/˚C resistance
temperature characteristic
Heat conducting
ceramic substrate
Exclusive thick film process
results in a very linear, negative,
3000 ppm/°C resistance
temperature characteristic
Digital Marking
High conductivity plate-on
nickel termination
Heat conducting
ceramic substrate
Tin or tin-lead electroplated
copper leads
Digital Marking
High conductivity plate-on
All Pb-free parts complyⁿⁱw^ckeit^l h^terE^mU^inaD^tioiⁿrective 2011/65/EU (RoHS2)
Tin or tin-lead electroplated
copper leads
Temperature
Coefficient
-0.30%/°C (minus
3000 ppm/°C @ 25°C)
Resistance
Ratio
Linearity
Standard Resistance
Values
R25°C/R125°C = _{<1.2% deviation per 100°C}
1.37
(typical over range from -55°C to 140°C)
740, 1K and 10K. Others
available
Std. Resistance
Tol. @ 25°C
±2%, ±5%, ±10%
Operating
Temperature
Range
-55°C to + 175°C
High Temp
Stability
Time Constraints
Dissipation Constants
2000 hours @
175°C, <0.5%∆R
7.4 sec for RGT-1,
2.9 sec. for RGT-2
(time to achieve 63.2% of an applied
step-change in temperature in still air)
8.1mW/°C for RGT-1,
4.7mW°C for RGT-2
(power required to raise sensor temperature
1°C in a still air ambient of 25°C)
Element
fused thick-film
composition
Substrate
solid-core alumina
ceramic
Lead Pull
5 lbs for 5 sec.
Resistance to
Soldering Heat
MIL-STD-202E, Method
210A, cond. A, <0.5%∆R
Marking Resistance
to Solvents
MIL-STD-202, Method 215
Lead
Solderability
MIL-STD-202,
Method 208
Applications
Compensates transistors, diodes,
sensors, transducers, hall devices,
microprocessors, and strain gauges.
Proven in automotive under-hood use.
Curve Tolerances (±)
Temperature
-55°C
-15°C
0°C
25°C
50°C
75°C
100°C
125°C
150°C
175°C
-67°F
+9°F
+32°F
77°F
122°F
167°F
212°F
257°F
302°F
347°F
G Tol.
7%
4.5%
3.6%
±2%
2.5%
3.0%
3.5%
4.0%
4.5%
5.0%
J Tol.
10%
7.5%
6.6%
±5%
5.5%
6.0%
6.5%
7.0%
7.5%
8.0%
K Tol.
15%
12.5%
11.6%
±10%
10.5%
11.0%
11.5%
12.0%
12.5%
13.0%
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Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
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RGT Series Issue December 2008 Sheet 1 of 3
10.14