MRC Datasheet, PDF (1/2 Pages) TT Electronics. – Superior surge handling capability

Resistors
Metal Glaze™ High Power Density
Make Possible
S_Mu_Rrf_Cac_Se_eM_rieo_sunt Power Resistor
Metal Glaze^TM High Power Density
M_SR_uC_rfS_ae_cri_ees_{Mount Power Resistor}
1/2 watt in 1/8 watt package
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• ¹1⁵w⁰a^°Ctt ^min ^a1^x/2^imw^ua^mtt p^oa^pc^ek^ra^ag^tie^ng(2^t0^e1^m0^pfo^eo^ratp^turi^rn^et)
• ^SM^uR^pC^er1ⁱ/^o2^r: ^s0^u.0^rg5^eΩ^ht^aoⁿ1^d.^l0ⁱⁿΩ^{g capability}
(RcooHntSacctofamcptolriaynfotrVheigrhsieornvsalauveasi)lable
• 150°C maximum operating temperature
• Superior surge handling capability
Metal Glaze^™ thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)
60/40 Solder over nickel barrier
Electrical Data
Size Industry IRC
Max.
Working Max. Resistance Tolerance TCR
Code¹ Footprint Type Power Rating Voltage² Voltage Range (ohms)³ (±%)³ (ppm/°C)³
0.1 to 0.99
1,2,5
100
C
1206 MRC1/2 1/2W @ 70°C
200
400
1.0 to 10K
1,2,5
50,100
20 to 10K
0.25, 0.5
50,100
Product
Catagory
Low Range
Standard
Tight Tolerance
MRC Applications:
The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint. The MRC is recommended for applications where
board real estate is a major concern. Due to high power density and superior surge handling capability, it is also
recommended as a direct replacement on existing board designs where standard 1206 resistors are marginal or failing.
Environmental Data
Characteristics
Maximum Change
Temperature Coefficient
As specified
Thermal Shock
±(0.5% + 0.01Ω)
Low Temperature Operation
±(0.25% + 0.01Ω)
Short Time Overload
±(1.0% + 0.01Ω)
High Temperature Exposure
±(0.5% + 0.01Ω)
Resistance to Bonding Exposure ±(0.25% + 0.01Ω)
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
95% minimum coverage
±(0.5% + 0.01Ω)
±(1.0% + 0.01Ω)
±(1% + 0.01Ω)
no mechanical damage
±(1% + 0.01Ω)
no mechanical damage
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x _√ PxR for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip
for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronicsresistors.com
01.16