HSF-1-100-2700-K Datasheet, PDF (1/4 Pages) TT Electronics. – High Surge Film Surface Mount Metal GlazeTM

Resistors
High Surge Film
S_Hu_Sr_Fface Mount Metal Glaze^TM
H^HSF^igSe^hrie^Ss ^{urge Film}
Surface Mount Metal Glaze^TM
150°C maximum operating temperature
RoHS - compatible components available
•^U1^pW^toat^tt^ra^ipnd^le1^t/^h2^eW^sa^utt^rp^go^ew^re^ar^tirⁿat^gin^og^{f the rugged CHP1}
•^Re15^p0^la°C^cem^sa^cx^oim^stu^lym^so^up^re^fara^ct^ein^-g^mte^om^unpe^tr^watⁱu^rr^ee^{wound resistors}
Metal Glaze^TM
lm element
red at 1000˚C
to solid ceramic
Metal Glaze^TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
High
temperature
dielectric
coating
• RoHS - Compatible Components Available
• Up to triple the surge rating of the rugged CHP1
• Replaces costly surface-mount wirewound resistors
High
temperature
dielectric
All Pb-free parts comply with EU^cD^oair^tieⁿc^gtive 2011/65/EU (RoHS2)
Solder over
nickel barrier
Electrical Data
Industry
Footprint
Type
Maximum _Working
Power Rating _Voltage
2512
HSF-1
1W @ 70°C
350
3612
HSF-2
2W @ 25°C 500
Resistance
Range (Ω)
5R9, 6R8, 11R, 27R,
12R, 68R, 270R
8R2, 22R, 300R
Tolerance
TCR
(±%)
(ppm/°C)
Product
Category
10
±200¹ High Surge
10
±200¹ High Surge
Note 1 – Standard TCR is ±200ppm/°C. TCR of ±100ppm/°C is available at selected values on request.
Environmental Data
Characteristics
Maximum Change
Test Method
Temperature Coefficient
As specified
MIL-R-55342H Par 4.7.9 (-55°C +125°C)
Thermal Shock
±0.5% +0.01 ohm MIL-R-55342H Par 4.7.3 (-65°C +150°C, 5 cycles)
Low Temperature Operation
±0.25% +0.01 ohm MIL-R-55342H Par 4.7.4 (-65°C @ working voltage)
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
±0.5% +0.01 ohm
±0.5% +0.01 ohm
MIL-R-55342H Par 4.7.5
2.5 x √P x R for 5 seconds
MIL-R-55342H Par 4.7.6 (+150°C for 100 hours)
±0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (reflow soldered to board at 260°C for 10 seconds)
95% min. coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance
±0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours)
Life Test
Terminal Adhesion Strength
Resistance to Board bending
±0.5% +0.01 ohm MIL-R-55342H Par 4.7.10 (2000 hours at 70°C intermittent)
±1% +0.01 ohm
no mechanical damage
1200 gram push from underside of mounted chip for 60 seconds
±1% +0.01 ohm
Chip mounted in center of 90mm long board, deflected 5mm so
no mechanical damage _{as to exert pull on chip contacts for 10 seconds}
G^Ge^enⁿe^er^ra^al^lN^No^ote^te
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Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
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BI Technologies IRC Welwyn
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HSF-1 Series Issue October 2010 Sheet 1 of 4
04.16