TS39100_07 Datasheet, PDF (6/13 Pages) Taiwan Semiconductor Company, Ltd – 1A Ultra Low Dropout Voltage Regulator with Multi-Function

TS39100/1/2/3/4/5
1A Ultra Low Dropout Voltage Regulator
with Multi-Function
Application Information (Continue)
Enable Input
TS39101/2/3/4/5 versions feature an active-high enable (EN) input that allows ON/OFF control of the regulator.
Current drain reduces to “zero” when the device is shutdown, with only micro-amperes of leakage current. The EN
input has TTL/CMOS compatible thresholds for simple interfacing with logic interfacing. EN may be directly tied to V_iN
and pulled up to the maximum supply voltage.
Error Flag
TS39101/3 versions feature an Error Flag, which looks at the output voltage and signals an error condition when this
voltage drops 5% below its expected value. The error flag is an open-collector output that pulls low under fault
conditions. It may sink 10mA. Low output voltage signifies a number of possible problems, including an over-current
fault (the device is in current limit) or low input voltage. The flag output is inoperative during over temperature
shutdown conditions. A pull-up resistor from error flag to either V_iN or V_OUT is required for proper operation. For
information regarding the minimum and maximum values of pull-up resistance, refer the graph as follow:
Thermal Resistance
Power SOP-8 Thermal Characteristic
TS39101/2/4 series’ performance is its power SOP-8 package featuring half the thermal resistance of a standard SOP-
8 package. Lower thermal resistance means more output current or higher input voltage for a standard SOP-8
package. Lower thermal resistance means more output current or higher input voltage for a given package size.
Lower thermal resistance is achieved by connect the four ground pins with the die attached pad to create a single
piece electrical and thermal conductor. This concept have been used by MOSFET production for years, proving very
reliable and cost effective for the user. As above thermal resistance figure. Thermal resistance consists of two main
elements, Θ_JC (junction to case) and Θ_CA (case to ambient). Using the power SOP-8 reduces Θ_CA, the total thermal
resistance, Θ_JA (junction to ambient) is the limiting factor in calculating the maximum power dissipation capability of the
device. Typically, the power SOP-8 have a Θ_JC of 20^oC/W dramatically , this is significantly lower than the standard
SOP-8 which is typically 75^oC/W. Θ_CA is reduced because pin 5~8 can be soldered directly to a ground plane which
significantly reduces the case to sink and sink to ambient thermal resistance.
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Version: B07