TS19601_15 Datasheet, PDF (6/8 Pages) Taiwan Semiconductor Company, Ltd – 700mA High Voltage Adjustable Current Regulator With Enable Control

TS19601
700mA High Voltage Adjustable Current Regulator
With Enable Control
Thermal Consideration Information
The Maximum Power Dissipation on Current Regulator
P_D(MAX) = V_OUT(MAX) × I_OUT(NOM) + V_IN(MAX) × I_DD
Where :
V_OUT(MAX) = the maximum voltage on output pin;
I_OUT(NOM) = the nominal output current;
I_DD = the quiescent current the regulator consumes at I_OUT(NOM);
V_IN(MAX) = the maximum input voltage.
Thermal Consideration
The TS19601 has internal power and thermal limiting circuitry designed to protect the device under overload
conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load
conditions. The thermal protection circuit of TS19601 prevents the device from damage due to excessive power
dissipation. When the device junction temperature rises to approximately 150°C, the regulator will be turned off.
When power consumption is over about 1000mW (TO-252 package, at T_A=70°C), additional heat sink is required to
control the junction temperature below 125°C.
The junction temperature is:
T_J = P_D (R_θJT + R_θCS + R_θSA ) + T_A
Where :
P_D : Dissipated power.
R_θJT: Thermal resistance from the junction to the mounting tab of the package.
For TO-252 package, R_θJT = 7.0°C/W.
R_θCS: Thermal resistance through the interface between the IC and the surface on which it is mounted.
(typically, R_θCS < 1.0°C /W)
R_θSA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected
with several through-holes via.
PCB R_θJA ºC/W
59
PCB heat sink size
500
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
6/8
Version: C14