TESDH5V0A_15 Datasheet, PDF (3/5 Pages) Taiwan Semiconductor Company, Ltd – Ultra Low Capacitance ESD Protection Array

Small Signal Product
ORDER INFORMATION (EXAMPLE)
TESDH5V0A RDG
Green compound code
Packing code
Part no.
PACKAGE OUTLINE DIMENSIONS
2510P10 (DSON10)
SUGGESTED PAD LAYOUT
TESDH5V0A
Taiwan Semiconductor
DIM.
A
B
C
D
E
F
G
H
I
Unit (mm)
Min Max
2.40 2.60
0.90 1.10
0.50 REF
0.63 REF
0.30 0.43
0.45 0.55
0.50 0.65
0.15 0.25
0.35 0.45
Unit (inch)
Min Max
0.094 0.102
0.035 0.043
0.020 REF
0.025 REF
0.012 0.017
0.018 0.022
0.020 0.026
0.006 0.010
0.014 0.018
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Typ.
0.88
0.20
0.50
1.00
0.20
0.40
0.68
1.55
Unit (inch)
Typ.
0.035
0.008
0.020
0.039
0.008
0.016
0.027
0.061
Note: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary depending on application.
Document Number: DS_S1501021
Version: D15