TS25P01G_1 Datasheet, PDF (1/2 Pages) Taiwan Semiconductor Company, Ltd – Single Phase 25.0 AMPS. Glass Passivated Bridge Rectifiers

TS25P01G - TS25P07G
Single Phase 25.0 AMPS.
Glass Passivated Bridge Rectifiers
TS-6P
Features
UL Recognized File # E-96005
Glass passivated junction
Ideal for printed circuit board
Reliable low cost construction
Plastic material has Underwriters Laboratory
Flammability Classification 94V-0
Surge overload rating to 300 amperes peak
High case dielectric strength of 2000 VRMS
Isolated voltage from case to lead over
2500 volts
C .118(3.0)
X45⁰
1.193(30.3)
1.169(29.7)
.189(4.8)
.173(4.4)
.150(3.8)
.134(3.4)
.106(2.7)
.091(2.3)
.094(2.4)
.079(2.0)
.043(1.1)
.035(0.9)
.303
(7.7)
.287
(7.3)
.402(10.2)
.386(9.8)
.303
(7.7)
.287
(7.3)
.799(20.3)
.776(19.7)
.189(4.8)
.441(11.2)
.425(10.8)
.165(4.2) .709(18.0)
.150(3.8) .669(17.0)
.134(3.4)
.122(3.1)
.114(2.9)
.098(2.5)
.031(0.7)
.024(0.6)
Mechanical Data
Case: Molded plastic
Terminals: Leads solderable per
MIL-STD-750, method 2026
Weight: 0.3 ounce, 8 grams
Mounting torque: 8.17 in. lbs. max.
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25 ^oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol ^{TS25P TS25P TS25P TS25P TS25P TS25P TS25P} Units
01G 02G 03G 04G 05G 06G 07G
Maximum Recurrent Peak Reverse Voltage V_RRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage
V_RMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
See Fig. 1
V_DC
I_(AV)
50 100 200 400 600 800 1000 V
25
A
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
I_FSM
350
A
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
@ 12.5A
V_F
1.0
V
@ 25A
1.1
Maximum DC Reverse Current @ TA=25 ^oC
at Rated DC Blocking Voltage @ TA=125 ^oC
I_R
10
uA
500
uA
Typical Thermal Resistance (Note)
R_θJC
0.6
o_C/W
Operating Temperature Range
TJ
-55 to +150
o_C
Storage Temperature Range
TSTG
-55 to + 150
o_C
Note: Thermal Resistance from Junction to Case with Device Mounted on 300mm x 300mm x 1.6mm
Cu Plate Heatsink.
- 710 -
Version: B07