TS25P01G_09 Datasheet, PDF (1/2 Pages) Taiwan Semiconductor Company, Ltd – Single Phase 25.0 AMPS. Glass Passivated Bridge Rectifiers

Pb
RoHS
COMPLIANCE
TS25P01G - TS25P07G
Single Phase 25.0 AMPS.
Glass Passivated Bridge Rectifiers
TS6P
Features
— UL Recoganized File # E-326243
— Glass passivated junction
— Ideal for printed circuit board
— High case dielectric strength of 2500V_RMS
— Plastic material has Underwriters laboratory
flammability Classification 94V-0
— Typical IR less than 0.1uA
— High surge current capability to 200A
— High temperature soldering guaranteed:
260℃ / 10 seconds at 5 lbs., ( 2.3 kg ) tension
— Green compound with suffix “G” on packing code &
prefix “G” on datecode.
Dimension in inches and (millimeter)
Mechanical Data
— Case : Molded plastic body
— Terminal : Pure tin plated , Lead free. Leads solderable per
MIL-STD-202 Method 208
— Weight : 7.15 grams (0.252 ounce)
— Mounting Torque : 8.17 in-lbs Max.
Maximum Ratings and Electrical Characteristics
Rating at 25℃ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
TS25P TS25P TS25P TS25P TS25P TS25P TS25P
Symbol
01G 02G 03G 04G 05G 06G 07G
Maximum Recurrent Peak Reverse Voltage
V_RRM
50 100 200 400 600 800 1000
Maximum RMS Voltage
V_RMS
35
70 140 280 420 560 700
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
@ T _c = 100^oC
V_DC
50 100 200 400 600 800 1000
I_(AV)
25.0
Peak Forward Surge Current, 8.3 ms Single Half Sine-
wave Superimposed on Rated Load (JEDEC method )
I_FSM
300
Rating of fusing ( t < 8.3mS )
I²t
373
Maximum Instantaneous Forward Voltage
@ 12.5A
V_F
1.0
@ 25.0A
1.1
Maximum DC Reverse Current @ TA=25℃
10
at Rated DC Blocking Voltage @ TA=125℃
I_R
500
Typical Junction Capacitance per leg (Note 1)
Cj
140
Typical Thermal Resistance (Note 2)
R_θJC
Operating Temperature Range
T_J
Storage Temperature Range
T_STG
Note 1 : Measured at 1MHz and applied Reverse bias of 4.0V DC.
0.6
-55 to +150
-55 to +150
2. Device mounted on 4" x 5" x 0.25" Al-plate heat sink,
Units
V
V
V
A
A
A²S
V
uA
pF
oC/W
O_C
O_C
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Version : D09