TS10B01G_09 Datasheet, PDF (1/2 Pages) Taiwan Semiconductor Company, Ltd – Single Phase 10.0 Amps. Glass Passivated Bridge Rectifiers

TS10B01G - TS10B07G
Single Phase 10.0 Amps.
Glass Passivated Bridge Rectifiers
TS4B
Features
UL Recognized File # E-96005
Glass passivated junction
Ideal for printed circuit board
Reliable low cost construction
Plastic material has Underwriters Laboratory
Flammability Classification 94V-0
Surge overload rating to 150 amperes peak
High case dielectric strength of 2000VRMS
Isolated voltage from case to lead over 2500
volts.
High temperature soldering guaranteed:
260^oC / 10 seconds / 0.375”(9.5mm) lead length
at 5 lbs (2.3Kg) tension
Mechanical Data
0
.118(3.0)X45
.996(25.3)
.972(24.7)
.147(3.7)
.130(3.3)
.043(1.1)
.035(0.9)
.602(15.3)
.579(14.7)
.134(3.4)
.122(3.1)
.176(4.37) .068(1.73)
.156(3.96) _.060(1.52)
.709(18)
.669(17)
.382(9.7)
.366(9.3)
.087(2.2)
.071(1.8)
.303(7.7)
.287(7.3)
.030(0.75)
.022(0.55)
Dimensions in inches and (millimeters)
Case: Molded plastic
Terminals: Leads solderable per MIL-
STD-750 Method 2026
Weight: 0.15 ounce, 4 grams
Mounting torque: 5 in. lbs. max.
Maximum Ratings and Electrical Characteristics
Rating at 25 ^oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol ^{TS10B TS10B TS10B TS10B TS10B TS10B TS10B} Units
01G 02G 03G 04G 05G 06G 07G
Maximum Recurrent Peak Reverse Voltage V_RRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage
V_RMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage
V_DC 50 100 200 400 600 800 1000 V
Maximum Average Forward Rectified Current _I(AV)
10
A
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
I_FSM
150
A
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
@ 5.0A
@ 10A
Maximum DC Reverse Current @ TA=25 ^oC
at Rated DC Blocking Voltage @ TA=125 ^oC
Typical Thermal Resistance (Note)
Operating Temperature Range
Storage Temperature Range
V_F
I_R
R_θJC
TJ
TSTG
1.0
1.1
5.0
500
1.4
-55 to +150
-55 to + 150
V
uA
uA
o_C/W
o_C
o_C
Note: Thermal Resistance from Junction to Case with Device Mounted on 75mm x 75mm x 1.6mm
Cu Plate Heatsink.
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Version: D09