SS13M_14 Datasheet, PDF (1/5 Pages) Taiwan Semiconductor Company, Ltd – Surface Mount Schottky Barrier

FEATURES
CREAT BY ART
Surface Mount Schottky Barrier
- Very low profile - typical height of 0.68mm
- Low power loss, high efficiency
- Ideal for automated placement
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
SS13M thru SS16M
Taiwan Semiconductor
MECHANICAL DATA
Case: Micro SMA
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - Green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.006 g (approximately)
Micro SMA
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T_A=25℃ unless otherwise noted)
PARAMETER
SYMBOL SS13M
SS14M
SS16M
Marking code
A
B
C
Maximum repetitive peak reverse voltage
V_RRM
30
40
60
Maximum average forward rectified current
I_F(AV)
1
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
I_FSM
25
Maximum instantaneous forward voltage (Note 1)
@ 0.5A / T_J=25 ℃
@ 0.5A / T_J=125 ℃
@ 1.0A / T_J=25 ℃
@ 1.0A / T_J=125 ℃
Maximum reverse current @ rated VR
@ T_J=25 ℃
@ T_J=125 ℃
@ T_J=150 ℃
Typical junction capacitance (Note 2)
TYP
MAX
TYP MAX
0.45
-
0.51 -
V_F
0.35
-
0.46 -
0.52
0.55
0.64 0.68
0.46
0.50
0.57 0.60
TYP
MAX
TYP MAX
5
I_R
3
50
5
50
10
3
10
5.3
-
6.7
-
Cj
50
40
Typical thermal resistance
R_θJL
R_θJC
R_θJA
30
40
125
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
T_J
T_STG
-55 to +150
-55 to +150
Note 2: Measured at 1 MHz and Applied Reverse Voltage of 4.0 V D.C.
UNIT
V
A
A
V
μA
mA
mA
pF
O_C/W
O_C
O_C
Document Number: DS_D1406008
Version: J14