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SRAD320 Datasheet, PDF (1/2 Pages) Taiwan Semiconductor Company, Ltd – 3.0 AMPS. Schottky Barrier Rectifiers
SRAD320 THRU SRAD360
3.0 AMPS. Schottky Barrier Rectifiers
Features
Voltage Range
20 to 60 Volts
Current
3.0 Amperes
D-PAK
Extremely fast switching
Extremely low forward drop
Guaranteed reverse avalanche
.250(6.55)
.246(6.45)
.211(5.36)
.207(5.26)
.093(2.35)
.089(2.25)
Marking
05
.013(0.54)
.011(0.48)
Mechanical Data
Cases: Epoxy, molded
Weight: 0.4 gram (approximately)
Finish: All external surfaces corrosion
resistant and terminal leads are readily
solderable
Lead and mounting surface temperature for
soldering purposes: 260OC max. for 10
seconds
Shipped 75 units per plastic tube
Marking: SRAD320, SRAD330, SRAD340,
SRAD350, SRAD360
.024(0.60)
.031(0.80)
.211(5.36)
.207(5.26)
30 5
.013(0.54)
.011(0.48)
.053(1.30)
.045(1.10)
05
.112(2.85)
.092(2.35)
.059(1.45)
.039(0.95)
123
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25℃ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol SRAD SRAD SRAD SRAD SRAD Units
320 330 340 350 360
Maximum Recurrent Peak Reverse Voltage
VRRM
20
30
40
50
60
V
Maximum RMS Voltage
VRMS
14
21
28
35
42
V
Maximum DC Blocking Voltage
VDC
20
30
40
50
60
V
Maximum Average Forward Rectified Current
(See Fig. 1)
I(AV)
3.0
A
Nonrepetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
IFSM
75
A
Halfwave, Single Phase, 60 HZ)
Peak Repetitive Reverse Surge Current (Note 1) IRRM
1.0
A
Maximum Instantaneous Forward Voltage @3.0A VF
0.55
0.7
V
Maximum D.C. Reverse Current @ Tc=25℃
at Rated DC Blocking Voltage @ Tc=125℃
IR
0.3
mA
20
mA
Maximum Thermal Resistance Per Leg
(Note 3)
RθJC
RθJA
6
80
℃/W
Typical Junction Capacitance (Note 2)
Cj
400
pF
Operating Junction Temperature Range
TJ
-65 to +150
-65 to +125 ℃
Storage Temperature Range
TSTG
-65 to +150
℃
Notes : 1. 2.0us Pulse Width, f=1.0KHZ.
2. Pulse Test : 300 us, 2.0% Duty Cycle.
3. Thermal resistance from Junction to Case and Thermal Resistance from Junction to Ambient.
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