MBS2_15 Datasheet, PDF (1/4 Pages) Taiwan Semiconductor Company, Ltd – Glass Passivated Bridge Rectifiers

CREAT BY ART
Glass Passivated Bridge Rectifiers
FEATURES
- Ideal for automated placement
- Reliable low cost construction utilizing molded plastic technique
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- UL Recognized File # E-326854
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MBS
- AEC-Q101 qualified
MBS2 thru MBS10
Taiwan Semiconductor
MECHANICAL DATA
Case: Molded plastic body
Molding compound, UL flammability classification rating 94V-0
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Polarity as marked on the body
Weight: 0.12 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T_A=25°C unless otherwise noted)
PARAMETER
SYMBOL MBS2 MBS4 MBS6 MBS8
Maximum repetitive peak reverse voltage
V_RRM
200
400
600
800
Maximum RMS voltage
V_RMS
140
280
420
560
Maximum DC blocking voltage
V_DC
200
400
600
800
Maximum average forward rectified current
On glass-epoxy P.C.B.
I_F(AV)
0.5
On aluminum substrate
0.8
MBS10
1000
700
1000
Unit
V
V
V
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
I_FSM
Maximum instantaneous forward voltage (Note 1)
I_F= 0.4 A
V_F
35
A
1.0
V
Maximum DC reverse current
at rated DC blocking voltage
T_J=25 °C
T_J=125 °C
I_R
5
100
Rating for fusing (t<8.3ms)
I²t
5.08
Typical junction capacitance per leg (Note 2)
C_J
13
(Note 3)
R_θJL
20
Typical thermal resistance (Note 4)
R_θJA
70
(Note 3)
R_θJA
85
Operating junction temperature range
Storage temperature range
Note 1: Pulse Test with PW=300μs,1% Duty Cycle
T_J
T_STG
- 55 to +150
- 55 to +150
Note 2: Measure at 1.0MHz and Applied Reverse Voltage of 4.0 Volts D.C.
Note 3: On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3mm x 1.3mm) pads
Note 4: On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20mm x 20mm) mounted on 0.05" x 0.05" (1.3mm x 1.3mm) solder pads
μA
A²s
pF
°C/W
°C
°C
Document Number: DS_D1410054
Version: N14