MBS2_11 Datasheet, PDF (1/2 Pages) Taiwan Semiconductor Company, Ltd – Single Phase 0.8 AMP Glass Passivated Bridge Rectifiers

creat by art
Pb
RoHS
COMPLIANCE
Features
— UL Recognized File # E-326243
— Ideal for printed circuit board
— Reliable low cost construction utilizing molded
plastic technique
— High surge current capability
— High temperature soldering guaranteed:
260℃/10 seconds at 5 lbs., (2.3kg) tension
— Small size, simple installation
— Green compound with suffix "G" on packing
code & prefix "G" on datecode
MBS2 - MBS10
Single Phase 0.8 AMP Glass Passivated Bridge Rectifiers
MBS
Mechanical Data
— Case: Molded plastic body
— Terminal: Leads solderable
per MIL-STD-202 Method 208
— Weight: 0.123 grams
Maximum Ratings and Electrical Characteristics
Rating at 25 ℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol MBS2
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
V_RRM
200
V_RMS
140
V_DC
200
Maximum Average Forward Rectified Current
On glass-epoxy P.C.B.
On aluminum substrate
I_F(AV)
Dimensions in inches and (millimeters)
Marking Diagram
MBSX = Specific Device Code
G
= Green Compound
Y
= Year
M
= Work Month
MBS4
400
280
400
MBS6
600
420
600
MBS8 MBS10 Unit
800
1000
V
560
700
V
800
1000
V
0.5
A
0.8
Peak Forward Surge Current, 8.3 ms Single Half Sine-
wave Superimposed on Rated Load (JEDEC method)
I_FSM
35
A
Maximum Instantaneous Forward Voltage (Note 1)
@ 0.4A
V_F
1.00
V
Maximum DC Reverse Current
at Rated DC Blocking Voltage
T_A=25 ℃
T_A=125 ℃
I_R
Typical Junction Capacitance Per Leg (Note 2)
Cj
5
uA
100
13
pF
(Note 3)
R_θjA
Typical Thermal Resistance (Note 4)
R_θjA
(Note 3)
R_θjL
85
70
O_C/W
20
Operating Temperature Range
T_J
- 55 to + 150
O_C
Storage Temperature Range
T_STG
- 55 to + 150
O_C
Note 1: Pulse Test with PW=300 usec,1% Duty Cycle
Note 2: Measure at 1.0MHz and Applied Reverse Voltage of 4.0 Volts D.C.
Note 3: On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3mm x 1.3mm) pads
Note 4: On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20mm x 20mm) mounted on 0.05" x 0.05" (1.3mm x 1.3mm) solder pads
Version:H11