LLDB3 Datasheet, PDF (1/2 Pages) Formosa MS – DIAC

Small Signal Diode
LLDB3-LLDB3TG
150mW Bi-directional Trigger Diode
MINI-MELF (LL34)
HERMETICALLY SEALED GLASS
Features
—Designed for through-Hole Device Type Mounting.
—Hermetically Sealed Glass.
—All external suface are corrosion resistant and
terminals are readily solderable.
—High reliability glass passivation insuring parameter
stability and protection against junction contamination.
—Pb free version and RoHS compliant
Mechanical Data
—Case :MINI-MELF hermetically sealedglass
—Terminal: Pure tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
—High temperature soldering guaranteed: 270°C/10s
—Polarity : Indicated by cathode band
—Weight : 29 ± 2.5 mg
Ordering Information
C
B
D
A
Dimensions
A
B
C
D
Unit (mm)
Min Max
3.30 3.70
1.40 1.60
0.25 0.40
1.25 1.40
Unit (inch)
Min Max
0.130 0.146
0.055 0.063
0.010 0.016
0.049 0.055
Part No.
Package
Packing
LLDB3/LLDB3TG L1 MINI-MELF 2.5Kpcs / 7" Reel
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Repetitive Peak Forward Current
Pulse Width=
20μsec
Thermal Resistance (Junction to Ambient) (Note 1)
Junction and Storage Temperature Range
Symbol
PD
IFRM
RθJA
TJ, TSTG
Value
150
2
400
-40 to + 125
Electrical Characteristics
Type Number
Break-over Voltage
Break-over Voltage Symmetry
Break-over Current
Maxiumn Leakage Current
Junction Capacitance
Output Voltage
Reverse Recovery Time
C=
22nF
C=
22nF
C=
22nF
V_R=
0.5V
VR=0, f=1.0MHz
(Note2)
Symbol
VBO
+ / -VBO
I_BO
IR
CJ
VO
Trr
LLDB3TG
LLDB3
32
32
+/-2
+/-3
100
15
10
22.0
5
1.5
Notes:1. Valid provided that electrodes are kept at ambient temperature
Notes:2. Test Condition : IF=0.5A, RL=100Ω
Units
mW
A
°C/W
°C
Units
V
V
nA
μA
nF
V
μs
Version : B09