FR1601G_1 Datasheet, PDF (1/2 Pages) Taiwan Semiconductor Company, Ltd – 16.0 AMPS. Glass Passivated Fast Recovery Rectifiers

FR1601G - FR1607G
16.0 AMPS. Glass Passivated Fast Recovery Rectifiers
TO-220AB
Features
Glass passivated chip junction.
High efficiency, Low VF
High current capability
High reliability
High surge current capability
Low power loss
Mechanical Data
Cases: TO-220AB molded plastic
Epoxy: UL 94V-0 rate flame retardant
Terminals: Pure tin plated, Lead free. Leads
solderable per MIL-STD-202, Method 208
guaranteed
Polarity: As marked
High temperature soldering guaranteed:
260 ^oC /10 seconds .16”,(4.06mm) from
case.
Mounting position: Any
Weight: 2.24 grams
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25 ^oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol ^{FR FR FR FR FR FR} FR Units
1601G 1602G 1603G 1604G 1605G 1606G 1607G
Maximum Recurrent Peak Reverse Voltage V_RRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage
V_RMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
See Fig. 1
V_DC
I_(AV)
50 100 200 400 600 800 1000 V
16.0
A
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
I_FSM
150
A
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
@ 8.0A
V_F
Maximum DC Reverse Current @ TC=25 ^oC
at Rated DC Blocking Voltage @ TC=125 ^oC
I_R
1.3
V
5.0
uA
100
uA
Maximum Reverse Recovery Time ( Note 1) Trr
150
250
500
nS
Typical Junction Capacitance (Note 3)
Cj
60
pF
Typical Thermal resistance (Note 2)
R_θJC
3.0
Operating and Storage Temperature Range TJ ,TSTG
-65 to +150
Notes:
1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A.
2. Thermal Resistance from Junction to Case Per Leg Mounted on Heatsink Size
2” x 3” x 0.25” Al-Plate..
3. Measured at 1MHz and Applied Reverse Voltage of 4.0 Volts D.C.
o_C/W
o_C
Version: A06