BC817W Datasheet, PDF (1/6 Pages) NXP Semiconductors – NPN general purpose transistor

BC817-16W/25W/40W
200mW, NPN Small Signal Transistor
Small Signal Product
Features
◇ Epitaxial planar die construction
◇ Surface device type mounting
◇ Moisture sensitivity level 1
◇ Matte Tin(Sn) lead finish with Nickel(Ni) underplate
◇ Pb free version and RoHS compliant
◇ Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
Mechanical Data
◇ Case : SOT- 323 small outline plastic package
◇ Terminal : Matte tin plated, lead free, solderable
per MIL-STD-202, method 208 guaranteed
◇ High Temperature Soldering Guaranteed: 260°C/10s
◇ Weight : 0.005 grams (approximately)
Ordering Information (example)
SOT-323
Part No.
Package
Packing
Packing code
BC817-16W
SOT-323
3K / 7 " Reel
RF
Note : Detail please see "Ordering Information(detail, example)" below.
Packing code
(Green)
RFG
Manufacture code
B0
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Parameter
Power Dissipation
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature Range
Notes : 1. Transistor mounted on a FR4 printed-circuit board
Symbol
P_D
V_CBO
V_CEO
V_EBO
I_C
R_θJA
T_J, T_STG
Value
200
50
45
5
0.5
625
-55 to + 150
Units
mW
V
V
V
A
K/W
°C
Version : B13