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BC817-16W Datasheet, PDF (1/4 Pages) Siemens Semiconductor Group – NPN Silicon AF Transistor (For general AF applications High collector current High current gain) | |||
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Small Signal Diode
3 Collector
1 Base 2 Emitter
Features
ÂEpitaxial planar die construction
ÂSurface device type mounting
ÂMoisture sensitivity level 1
ÂMatte Tin(Sn) lead finish with Nickel(Ni) underplate
ÂPb free version and RoHS compliant
ÂGreen compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
Mechanical Data
ÂCase : SOT-323 small outline plastic package
ÂTerminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
ÂHigh temperature soldering guaranteed: 260°C/10s
ÂWeight : 0.005gram (approximately)
Ordering Information
Package
Part No.
SOT-323 BC817-16W RF
SOT-323 BC817-25W RF
SOT-323 BC817-40W RF
SOT-323 BC817-16W RFG
SOT-323 BC817-25W RFG
SOT-323 BC817-40W RFG
Packing
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
Marking
6CR
6CS
6CT
6CR
6CS
6CT
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Thermal Resistance,Junction to Ambient
Junction and Storage Temperature Range
1)Transistor mounted on an FR4 printed-circuit board.
Symbol
PD
VCBO
VCEO
VEBO
IC
RÓ©JA
TJ, TSTG
BC817-16W/25W/40W
200mW, NPN Small Signal Transistor
SOT-323
A
F
B
E
C
D
Dimensions
A
B
C
D
E
F
Unit (mm)
Min Max
1.90 2.10
1.15 1.35
0.25 0.35
1.20 1.40
2.00 2.20
0.80 1.00
Unit (inch)
Min Max
0.075 0.083
0.045 0.053
0.010 0.014
0.047 0.055
0.079 0.087
0.031 0.039
Suggested PAD Layout
0.65
0.026
0.8
0.031
0.8
0.031
1.6
0.063
Value
200
50
45
5
0.5
625
-65 to + 150
Units
mW
V
V
V
A
k/w
°C
Version : A11
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