BC807W Datasheet, PDF (1/4 Pages) NXP Semiconductors – PNP general purpose transistor

Small Signal Diode
3 Collector
1 Base 2 Emitter
Features
—Epitaxial planar die construction
—Surface device type mounting
—Moisture sensitivity level 1
—Matte Tin(Sn) lead finish with Nickel(Ni) underplate
—Pb free version and RoHS compliant
—Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
Mechanical Data
—Case : SOT-323 small outline plastic package
—Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
—High temperature soldering guaranteed: 260°C/10s
—Weight : 0.005gram (approximately)
Ordering Information
Package
Part No.
SOT-323 BC807-16W RF
SOT-323 BC807-25W RF
SOT-323 BC807-40W RF
SOT-323 BC807-16W RFG
SOT-323 BC807-25W RFG
SOT-323 BC807-40W RFG
Packing
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
Marking
5CR
5CS
5CT
5CR
5CS
5CT
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Thermal Resistance,Junction to Ambient
Junction and Storage Temperature Range
1)Transistor mounted on an FR4 printed-circuit board.
Symbol
PD
V_CBO
V_CEO
V_EBO
IC
RÓ©JA
TJ, TSTG
BC807-16W/25W/40W
200mW, PNP Small Signal Transistor
SOT-323
A
F
B
E
C
D
Dimensions
A
B
C
D
E
F
Unit (mm)
Min Max
1.90 2.10
1.15 1.35
0.25 0.35
1.20 1.40
2.00 2.20
0.80 1.00
Unit (inch)
Min Max
0.075 0.083
0.045 0.053
0.010 0.014
0.047 0.055
0.079 0.087
0.031 0.039
Suggested PAD Layout
0.65
0.026
0.8
0.031
0.8
0.031
1.6
0.063
Value
200
50
45
5
0.5
625
-55 to + 150
Units
mW
V
V
V
A
k/w
°C
Version : A11