TGV2562-SM_15 Datasheet, PDF (9/14 Pages) TriQuint Semiconductor – 9.5 – 10.3 GHz VCO with Divide by 2

Application Circuit
PC Board Layout
TGV2562-SM
9.5 – 10.3 GHz VCO with Divide by 2
Top RF layer is 0.008” thick Roger RO4003, є_r = 3.38. Microstrip 50Ω line detail: width =0.0175”. For further
technical information, refer to the TGV2562-SM Product Information page.
The pad pattern shown has been developed and tested for optimized assembly at Triquint Semiconductor. The
PCB land pattern has been developed to accommodate lead and package tolerance. Since surface mount
processes vary from company to company, careful process development is recommended.
Top layer
GND layer
1 oz Cu
Roger 4003 0.008"
1/2 oz Cu
FR4
0.062"
Bottom layer
1 oz Cu
2561
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Bill of Material
Ref Des
Value Description
C1
100 pF Ceramic Cap, 0402
C2
1 µF Ceramic Cap, 0603
C3
10 µF Tantalum Cap, 0805/1206
P_Rre₁lim_{, R}ina₂ry Datasheet: Rev- 05₀-1_o4-_h1_m3 _{Chip Res, 0402} - 9 of 14 -
© 2013 TriQuint
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