TGV2539-SM_15 Datasheet, PDF (9/14 Pages) TriQuint Semiconductor – 10.7 – 11.5 GHz VCO with Divide by 2

Application Circuit
PC Board Layout
TGV2539-SM
10.7 – 11.5 GHz VCO with Divide by 2
Top RF layer is 0.008” thick Roger RO4003, є_r = 3.38. Microstrip 50Ω line detail: width =0.0175”. For further
technical information, refer to the TGV2539-SM Product Information page.
The pad pattern shown has been developed and tested for optimized assembly at Triquint Semiconductor. The
PCB land pattern has been developed to accommodate lead and package tolerance. Since surface mount
processes vary from company to company, careful process development is recommended.
Top layer
GND layer
1 oz Cu
Roger 4003 0.008"
1/2 oz Cu
FR4
0.062"
Bottom layer
1 oz Cu
2561
YYWW
XXXX
Bill of Material
Ref Des
C1
C2
C3
R1, R2
Value Description
100 pF Ceramic Cap, 0402
1 µF Ceramic Cap, 0603
10 µF Tantalum Cap, 0805/1206
0 ohm Chip Res, 0402
Preliminary Datasheet: Rev- 05-30-13
© 2013 TriQuint
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Manufacturer
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Part Number
Disclaimer: Subject to change without notice
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