TGS4306-FC Datasheet, PDF (9/11 Pages) TriQuint Semiconductor – 70-90 GHz SP4T Switch Flip Chip

Mechanical Drawing
Drawing is for chip face up
TGS4306-FC
Units: millimeters (inches)
Thickness: 0.380 (0.015). Die x, y size tolerance: +/- 0.050 (0.002)
Chip edge to pillar dimensions are shown to center of pillar
Pillar # 1
RF IN
0.075 Ф
Pillar # 5
RF OUT 1
0.075 Ф
Pillar # 9
RF OUT 2
0.075 Ф
Pillar # 12
RF OUT 3
0.075 Ф
Pillar # 16
RF OUT 4
0.075 Ф
Pillar # 3
Vd1
0.075 Ф
Pillar # 7
Vd2
0.075 Ф
Pillar # 14
Vd3
0.075 Ф
Pillar # 18
Vd4
0.075 Ф
Pillar # 20, 21
DC Ground
0.075 Ф
Pillar # 2, 4, 6, 8, 10, 11, 13, 15, 17, 19
RF CPW Ground
0.075 Ф
9
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November 2009 © Rev B