TGS4307_15 Datasheet, PDF (6/9 Pages) TriQuint Semiconductor – 77 GHz Transceiver Switch

2.160
(0.085)
2.058
(0.081)
1.870
(0.074)
Product Data Sheet
August 5, 2008
Mechanical Drawing
TGS4307
0.123
(0.005)
0.880
(0.035)
1.230
(0.048)
1.638
(0.064)
3
4
2.038
(0.080)
1.873
2
5
(0.074)
1.274
(0.050)
1
6
1.274
(0.050)
0.775
7
(0.031)
0.463
11
(0.018)
0.123
(0.005)
0
10
9
8
0.335
(0.013)
0.103
(0.004)
0 0.103 ^0.341
(0.004) (0.013)
0.717
(0.028)
Units: millimeters (inches)
Thickness: 0.1016 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pads
Chip size tolerance: +/- 0.05 (0.002)
GND IS BACKSIDE OF MMIC
Bond Pad # 1 (Antenna Port 1)
Bond Pad # 2 (VB1)
Bond Pad # 3 (Antenna Port 2)
Bond Pad # 4 (VB2)
Bond Pad # 5 (VB3)
Bond Pad # 6 (Antenna Port 3)
Bond Pad # 7 (VB5)
Bond Pad # 8 (Source Port)
Bond Pad # 9 (LO Port)
Bond Pad # 10 (VB4)
Bond Pad # 11 (Receiver Port)
0.100 x 0.100 (0.004 x 0.004)
0.140 x 0.100 (0.006 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.140 (0.004 x 0.006)
0.140 x 0.100 (0.006 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.140 x 0.100 (0.006 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.140 (0.004 x 0.006)
0.100 x 0.100 (0.004 x 0.004)
1.657 1.760
(0.065) (0.069)
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
6
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