AM1-G_15 Datasheet, PDF (6/6 Pages) TriQuint Semiconductor – High Dynamic Range Gain Block

AM1
High Dynamic Range Gain Block
AM1-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded
(maximum 245 C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
A1G
XXXX-X
Product Marking
The AM1-G will be marked with an “A1G” designator.
An alphanumeric lot code (“XXXX-X”) is also marked
below the part designator on the top surface of the
package.
ESD / MSL Information
Land Pattern
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
MSL Rating:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes 1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Level 1 at +260 C convection reflow
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device.
Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to
ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink.
Ensure that the ground / thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the region where
the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc  Phone [phone]  FAX: [phone]  e-mail: [e-mail]  Web site: www.TriQuint.com
Page 6 of 6 May 2012