TQM4M9073_15 Datasheet, PDF (5/7 Pages) TriQuint Semiconductor – Through Line

TQM4M9073
Through Line
MANUFACTURING ENVIRONMENTS
COMPONENT HANDLING
All necessary special handling techniques shall be adopted in order to avoid contamination of metallization /
terminations. Examples include use of finger cots, plastic tweezers, etc.
PART PLACEMENT
A placement force of up to 500 grams is applied (using a 2.00 mm or a 0.080 inch diameter rod) to the center
of the part while remaining in its tape carrier.
COMPONENT SOLDERABILITY
Convection or Infrared Reflow
Part will comply with convection or infrared reflow soldering processes consistent with IPC/JEDEC J-STD-
020. TriQuint’s actual reflow profile for qualification is provided below:
Reflow Parameters
Average ramp-up rate (217C to Peak)
Preheat Time (150C to 200C)
Time above 217C
Peak Temperature
Time within 5C of actual Peak Temperature
Ramp-down Rate
Time 25C to Peak Temperature
IPC/JEDEC J-STD-020
3C/second max.
60-180 seconds
60-150 seconds
260 +0/-5C
20-40 seconds
6C/second max.
8 minutes max.
TriQuint Actual
0.57C/second
150 seconds
126 seconds
259C
30 seconds
0.875C/second
7 minutes max.
MATERIAL PACKAGING AND SHIPMENT
In the absence of customer specific requirements called out in the purchase order, material packaging and shipping
requirements shall be a defined in the paragraph and in TriQuint’s standard procedure for the packaging and shipment of
ICs in tape and reel.
GENERAL TAPE AND REEL REQUIREMENTS
Carrier and cover tape physical dimensions
Datasheet: Rev D 12-14-10
© 2010 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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