|
TGA2583_15 Datasheet, PDF (14/15 Pages) TriQuint Semiconductor – 2.7 3.7GHz 10W GaN Power Amplifier | |||
|
◁ |
TGA2583
2.7 â 3.7GHz 10W GaN Power Amplifier
Assembly Notes
Component placement and adhesive attachment assembly notes:
⢠Vacuum pencils and/or vacuum collets are the preferred method of pick up.
⢠Air bridges must be avoided during placement.
⢠The force impact is critical during auto placement.
⢠Organic attachment (i.e. epoxy) can be used in low-power applications.
⢠Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
⢠Use AuSn (80/20) solder and limit exposure to temperatures above 300ï°C to 3-4 minutes, maximum.
⢠An alloy station or conveyor furnace with reducing atmosphere should be used.
⢠Do not use any kind of flux.
⢠Coefficient of thermal expansion matching is critical for long-term reliability.
⢠Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
⢠Thermosonic ball bonding is the preferred interconnect technique.
⢠Force, time, and ultrasonic are critical parameters.
⢠Aluminum wire should not be used.
⢠Devices with small pad sizes should be bonded with 0.0007-inch wire.
Preliminary Datasheet: Rev B 02-20-15
© 2014 TriQuint
- 14 of 15 -
Disclaimer: Subject to change without notice
www.triquint.com
|
▷ |