TGS4306-FC_15 Datasheet, PDF (10/11 Pages) TriQuint Semiconductor – 70-90 GHz SP4T Switch Flip Chip

TGS4306-FC
Recommended Assembly Diagram
TGS4306-FC SP4T data represented in this datasheet was
taken using co-planar waveguide (CPW) transition on the
shown substrate and ground-signal-ground probes.
Bypass capacitors not required.
Alumina substrate board
Thickness: 0.015 in.
ε
r
=
9.9
RF OUT 1
Vd 1
RF IN
Vd 4
TGS4306-FC SP4T Die
RF OUT 4
Vd 2
RF OUT 2
RF OUT 3
Vd 3
Die is flip-chip soldered to substrate
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
10
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November 2009 © Rev B