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TGA1135B-SCC Datasheet, PDF (10/10 Pages) TriQuint Semiconductor – 18-27 GHz 1W Power Amplifier | |||
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Assembly Process Notes
Product Datasheet
January 21, 2002
TGA1135B-SCC
Reflow process assembly notes:
â¢= AuSn (80/20) solder with limited exposure to temperatures at or above 300ÎC
â¢= alloy station or conveyor furnace with reducing atmosphere
â¢= no fluxes should be utilized
â¢= coefficient of thermal expansion matching is critical for long-term reliability
â¢= storage in dry nitrogen atmosphere
Component placement and adhesive attachment assembly notes:
â¢= vacuum pencils and/or vacuum collets preferred method of pick up
â¢= avoidance of air bridges during placement
â¢= force impact critical during auto placement
â¢= organic attachment can be used in low-power applications
â¢= curing should be done in a convection oven; proper exhaust is a safety concern
â¢= microwave or radiant curing should not be used because of differential heating
â¢= coefficient of thermal expansion matching is critical
Interconnect process assembly notes:
â¢= thermosonic ball bonding is the preferred interconnect technique
â¢= force, time, and ultrasonics are critical parameters
â¢= aluminum wire should not be used
â¢= discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire
â¢= maximum stage temperature: 200ÎC
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
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