TQQ2504_15 Datasheet, PDF (1/1 Pages) TriQuint Semiconductor – Band 25/4 Carrier Aggregation Quadplexer

Applications
 LTE handset, data card & mobile router
applications
TQQ2504
Band 25/4 Carrier Aggregation Quadplexer
Product Features
 BAW and SAW technology
 High cross isolation
 Single-ended (SE) 50 Ohm Rx & Tx ports
 Performance -30 to +90 ºC
 Low insertion loss
 RoHS compliant, Pb-free
15 Pin 3.6 x 2.0 mm leadless package
Functional Block Diagram
General Description
The TQQ2504 is a high-performance Bulk Acoustic
Wave (BAW) and Surface Acoustic Wave (SAW)
quadplexer bank module designed to meet the strict
LTE requirements suitable for carrier aggregation
applications. Band 25 uses BAW technology and Band
4 uses SAW technology within one module.
TQQ2504 is specifically designed to meet the high
performance expectations of insertion loss, cross
isolation and linearity for LTE systems applications
under all operating conditions.
The TQQ2504 uses common module packaging
techniques to achieve the industry standard 3.6 x 2.0 x
0.9 mm footprint. The quadplexer band module
exhibits excellent power handling capabilities.
Pin Configuration – Single Ended
Pin No.
1
4
8
11
13
2,3,5,6,7,9,10,12,14,15
Label
Band 4 Rx
Band 25 Rx
Band 4 Tx
Band 25 Tx
Antenna
GND
Ordering Information
Part No.
TQQ2504
TQQ2504-EVB
Description
Product description
Evaluation board description
Preliminary Data Sheet: Rev - 12/15/2013
© 2013 TriQuint Semiconductor, Inc.
Page 1 of 8
Disclaimer: Subject to change without notice e
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