TQM7M5005 Datasheet, PDF (1/1 Pages) TriQuint Semiconductor – GSM/EDGE Multi-mode Power Amplifier Module

TQM7M5005
Advance Data Sheet
GSM/EDGE Multi-mode Power Amplifier Module
Functional Block Diagram
Features
DCS / PCS In
Mode Select
Band Select
VBATT
VRAMP
TX_EN
GSM 850 / 900 In
Logic
Power Control
DCS / PCS Out
GSM 850 / 900 Out
Product Description
The TQM7M5005 is an extremely small (5x5x1.0mm³) multi-mode power amplifier
module for GSM/EDGE applications. This module has been optimized for high
EDGE efficiency and EDGE power class E2 operation while maintaining high
GSM/GPRS efficiency. In EDGE mode, the Vramp pin provides a continuously
variable bias control to minimize current consumption during backed-off power
conditions.
The module incorporates two highly integrated InGaP power amplifier die with a
CMOS controller. The CMOS controller implements a fully integrated closed-loop
power control within the module for GSM Operation. This eliminates the need for
any external couplers, power detectors, current sensing etc., to assure the output
power level. The latter is set directly from the Vramp input from the DAC. The
module has Tx enable, band select, mode (EDGE or GSM) inputs. Module
construction is a low-profile over-molded land-grid array on laminate.
Electrical Specifications
850 Band
Parameter
Typ
GSM Pout ₃₅
Efficiency 55
Pin
3
EDGE Pout _28.5
Efficiency 24
Gain 32
ACPR
(400KHz)
62
900 Band
Typ
35
55
3
28.5
24
32
DCS Band
Typ
33
49
3
28
25
34
PCS Band
Typ
33
49
3
28
25
34
Units
dBm
%
dBm
dBm
%
dB
62
62
62
dBc
• Very compact size – 5×5×1.0 mm³.
• High GSM efficiency – GSM 850 55%,
GSM900 55%, DCS 49%, PCS 49%.
• High EDGE efficiency – GSM 850 24%, GSM
900 24%, DCS 25%, PCS 25%
• Positive supply voltage – 3.0 to 4.5 V
• 50 Ω input and output impedances
• GPRS class 12.
• CMOS band select and internal closed-loop
power control for GSM Operation.
• High-reliability InGaP technology.
• Ruggedness 10:1
• No external Vref Required
Applications
• GSM/EDGE handsets
• GSM/EDGE wireless cards & data links
Package Style
Package Size: LGA 5 x 5 x 1.0 mm
Top View
RF_{IN_DCS}
MODE
BS
RF_{OUT_DCS}
V_BATT
Ground
V_RAMP
TX_EN
RF_{IN_GSM}
RF_{OUT_GSM}
Advance Data Sheet: Subject to change without notice
1
For additional information and latest specifications, see our website: www.triquint.com
Revision C, January 25, 2008