TQM776011_15 Datasheet, PDF (1/1 Pages) TriQuint Semiconductor – Excellent Linearity in all modes

TQM776011
Datasheet
Multi-mode (WCDMA B1 / CDMA BC6 / HSPA+ / LTE) 3x3mm PA Module
Functional Block Diagram
VCC1
RF IN
Vmode1
Vmode0
VEN
2-Bit Bias Control
VCC2
RF OUT
CPLR IN
GND
CPLR OUT
Product Description
The TQM776011 is fully matched Power Amplifier Module designed for use in
WCDMA UMTS Band 1, CDMA BC6 (IMT) & LTE handsets. Its compact 3x3mm
package including a coupler and built-in voltage regulator makes it ideal for
today’s extremely small data enabled phones. Its RF performance meets the
stringent linearity requirements for multi-mode operation.
The TQM776011 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip^®
assembly offering state of the art reliability, temperature stability and ruggedness.
The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time
over the entire range of operating conditions. To simplify the cost/time of
calibration while in production the TQM776011 can be used in 1-bit operation;
either LPM/HPM with only 4mA of IcQ up to +13dBm in LPM, or MPM/HPM with
9mA of IcQ up to +17dBm in MPM.
Electrical Specifications
Parameter
Frequency
Typ
Units
1950
MHz
WCDMA mode maximum Pout¹
28.25
dBm
LPM Quiescent Current
4
mA
ACLR5
-41
dBc
ACLR10
-57
dBc
Power Supply Current @ 28.25dBm
490
mA
Rx Band Noise
-140
dBm/Hz
Note 1: Test Conditions WCDMA Rel99 Test Mode: VCC=3.4VDC, VEN=HIGH, Tc=25°C
Datasheet
For additional information and latest specifications, see our website: www.triquint.com
Revision Q, August 08, 2012
Features
 GaAs BiHEMT / CuFlip^® PA Technology
 Typical Quiescent Current values:
LPM: 4 mA
MPM: 9 mA
HPM: 90 mA
 Excellent Linearity in all modes
 Excellent Phase Discontinuity
 Integrated high performance coupler
 Built-in voltage regulator functionality
eliminating any external switch circuitry
 Small 10-pin, 3x3mm module
 Lead-free 260°C / RoHS / Halogen-free
 Full ESD protection
Applications
 WCDMA B1 Applications
 CDMA2000 IMT (BC6) Applications
 HSDPA/HSUPA/HSPA+ Applications
 LTE-Compatible Applications
Package Style
1
10
2
9
3
8
4
7
5
6
10-Pin Laminate Module
Top View (through package)
1