TQM756014 Datasheet, PDF (1/1 Pages) TriQuint Semiconductor – Multi-Mode (WCDMA B4, CDMA BC15, HSPA+, LTE) 3x3 PA Module

TQM756014
Data Sheet
Multi-Mode (WCDMA B4, CDMA BC15, HSPA+, LTE) 3x3 PA Module
Functional Block Diagram
VCC1
RF IN
Vmode1
Vmode0
VEN
2-Bit Bias Control
VCC2
RF OUT
CPLR IN
GND
CPLR OUT
Product Description
The TQM756014 is fully matched Power Amplifier Module designed for use in
CDMA BC15 (AWS), WCDMA (Bands 4) and LTE handsets. Its compact 3x3mm
package including a coupler and built-in voltage regulator makes it ideal for
today’s extremely small data enabled phones. Its RF performance meets the
stringent linearity requirements for multi-mode operation.
The TQM756014 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip^®
assembly offering state of the art reliability, temperature stability and ruggedness.
The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time
over the entire range of operating conditions. To simplify the cost/time of
calibration while in production the TQM776011 can be used in 1-bit operation;
either LPM/HPM with only 4mA of IcQ up to +13dBm in LPM, or MPM/HPM with
9mA of IcQ up to +17dBm in MPM.
Electrical Specifications
Parameter
Frequency
Typ
Units
1733
MHz
WCDMA mode maximum Pout¹
28.3
dBm
LPM Quiescent Current
4
mA
ACLR5
-40
dBc
ACLR10
-54
dBc
Power Supply Current @ 28.3dBm
490
mA
Rx Band Noise
-142
dBm/Hz
Note 1: Test Conditions WCDMA Rel99 Test Mode: VCC=3.4VDC, VEN=HIGH, Tc=25°C
Data Sheet:
For additional information and latest specifications, see our website: www.triquint.com
Revision J, August 08, 2012
Features
 GaAs BiHEMT / CuFlip^® PA Technology
 Typical Quiescent Current values:
LPM: 4 mA
MPM: 9 mA
HPM: 90 mA
 Excellent Linearity in all modes
 Integrated high performance coupler
 Excellent Phase Discontinuity
 Built-in voltage regulator functionality
eliminating any external switch circuitry
 Small 10-pin, 3x3mm module
 Lead-free 260°C / RoHS / Halogen-free
 Full ESD protection
Applications
 WCDMA B4 Handsets
 CDMA2000 BC15 (AWS) Applications
 HSUPA, HSDPA, HSPA+ Applications
 LTE-Compatible Applications
Package Style
1
10
2
9
3
8
4
7
5
6
10-Pin Laminate Module
Top View (through package)
1