TQM716015_15 Datasheet, PDF (1/1 Pages) TriQuint Semiconductor – Excellent Linearity in all modes

TQM716015
Data Sheet
Multi-mode (WCDMA B5 / CDMA BC0 / HSPA+ / LTE) 3x3mm PA Module
Functional Block Diagram
VCC1
RF IN
Vmode1
Vmode0
VEN
2-Bit Bias Control
VCC2
RF OUT
CPLR IN
GND
CPLR OUT
Product Description
The TQM716015 is fully matched Power Amplifier Module designed for use in
CDMA (BC0), WCDMA (Bands 5&6) and LTE handsets. Its compact 3x3mm
package including a coupler and built-in voltage regulator makes it ideal for
today’s extremely small data enabled phones. Its RF performance meets the
stringent linearity requirements for multi-mode operation.
The TQM716015 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip^®
assembly offering state of the art reliability, temperature stability and ruggedness.
The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time
over the entire range of operating conditions. To simplify the cost/time of
calibration while in production the TQM716015 can be used in 1-bit operation;
either LPM/HPM with only 3.5mA of IcQ up to +13dBm in LPM, or MPM/HPM with
11mA of IcQ up to +17dBm in MPM.
Electrical Specifications
Parameter
Frequency
Typ
Units
836
MHz
WCDMA mode maximum Pout¹
28.3
dBm
LPM Quiescent Current
3.5
mA
ACLR5
-41
dBc
ACLR10
-56
dBc
Power Supply Current @ 28.3dBm
510
mA
Rx Band Noise
-132
dBm/Hz
Note 1: Test Conditions WCDMA REL99 Test Mode: VCC=3.4VDC, VEN=HIGH, Tc=25°C
Data Sheet
For additional information and latest specifications, see our website: www.triquint.com
Revision N, August 08, 2012
Features
 GaAs BiHEMT / CuFlip^® PA Technology
 Typical Quiescent Current values:
LPM: 3.5 mA
MPM: 11 mA
HPM: 80 mA
 Excellent Linearity in all modes
 Excellent Phase Discontinuity
 Integrated high performance coupler
 Built-in voltage regulator functionality
eliminating any external switch circuitry
 Small 10-pin, 3x3mm module
 Lead-free 260°C / RoHS / Halogen-free
 Full ESD protection
Applications
 WCDMA B5 Applications
 CDMA2000 Cellular (BC0) Applications
 HSDPA/HSUPA/HSPA+ Applications
 LTE-Compatible Applications
Package Style
1
10
2
9
3
8
4
7
5
6
10-Pin Laminate Module
Top View (through package)
1