TQM713024_06 Datasheet, PDF (1/14 Pages) TriQuint Semiconductor – 3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module

TQM713024
Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module
Functional Block Diagram
Features
Vcc1
Vcc2
RF In
Input
Match
Output
Match
RF Out
Vmode
Vref
1st
2nd
Stage
Stage
PA
1 bit Bias Control
GND
GND
Product Description
The TQM713024 is a 3V, 2 stage GaAs HBT Power Amplifier Module designed for
use in mobile phones. Its compact 3x3mm package makes it ideal for today’s
extremely small data enabled phones. Its RF performance meets the
requirements for IS-95/98/CDMA2000 & WCDMA Rel99 standards.
The TQM713024 is designed on TriQuint’s advanced InGaP HBT GaAs
technology offering state of the art reliability, temperature stability and
ruggedness. Selectable bias mode and a shutdown mode with low leakage
current, improve talk and standby time. The output match, realized within the
module package, optimizes efficiency/linearity at maximum rated output power.
The TQM713024 has robust performance into mismatch and excellent linearity
margin under all operating conditions including the ability to operate in LP Mode all
the way to full output power.
Electrical Specifications
• InGaP HBT Technology
• High Efficiency: 38% @ 28dBm
• Capable of running as 0-bit PA in low bias
mode to 28dBm
• Supports new chipsets with Vref@2.6V
• Optimized for 50 ohm System
• Small 8-pin, 3x3mm module
• Excellent Rx band noise performance
• Lead-free 260°C RoHS Compliant
• Full ESD Protection
Applications
• IS-95/CDMA2000
• Single/Dual/Tri Mode CDMA/AMPS phones
Package Style
1
8
Parameter
Frequency
Min Typ Max
Units
824
849
MHz
CDMA mode maximum Pout¹
28
dBm
CDMA ACPR1 (@ 885kHz Offset)
-50 -46
dBc
CDMA ACPR2 (@ 1.98MHz Offset)
-60 -56
dBc
PAE @ 28dBm
34
38
%
ILK
5
µA
Rx Band Noise
-137
dBm/Hz
Test Conditions CDMA Mode: VCC1=3.4VDC, VCC2=3.4VDC, VREF =2.85VDC, Tc=25°C
Note 1:
Data Sheet
For additional information and latest specifications, see our website: www.triquint.com
Revision F, August 10, 2006
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8-Pin 3.0x3.0mm Plastic Module Package
Top View (X-ray)
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