TQHBT3 Datasheet, PDF (1/6 Pages) TriQuint Semiconductor – InGaP HBT Foundry Service

Production Process
TQHBT3
InGaP HBT Foundry Service
Metal 2 - 4um
Dielectric
Metal 1 - 2um
Metal 1 - 2um
E
B
Emitter B
Base
C
Collector
Sub Collector
Dielectric
C
Buffer & Substrate
NiCr
MIM
Metal 0
Isolation Implant
TQHBT3 Process Cross-Section
General Description
TriQuint’s new TQHBT3 process is a highly reliable InGaP
HBT process with three levels of interconnecting metal and
state-of-the-art device performance. Thick metal intercon-
nects and high quality passives promote integration. The thick
metal interconnects, which promote enhanced thermal man-
agement, and high density capacitors keep die sizes small.
MOCVD epitaxial processes are utilized to grow the active
layers. A carbon-doped Base and InGaP Emitter are utilized
for high RF performance consistent with high reliability. De-
signs utilizing the 3-um emitter width have the performance of
previous 2-um emitters, but with the reliability and ruggedness
associated with wider emitters. Precision NiCr resistors and
high value MIM capacitors are included. The three metal layers
are encapsulated in a high performance dielectric that allows
wiring flexibility and plastic packaging simplicity.
Features
• 2– and 3-um emitter widths
• >22 dB MAG @ 6 GHz; with 3-um
emitters
• Amplifier Ruggedness: VSWR 70:1
@ 5 V supply
• High Linearity in PA applications
• InGaP Emitter Process for High Re-
liability and Thermal Stability
• Base Etch Stop for Uniformity
• MOCVD Epitaxy
• High Density Interconnects;
• 2 Global, 1 Local
• Over 6 µm Total Thickness
• Dielectric Encapsulated Metals
• Thick Metal Interconnects:
• Enhanced Thermal Management
• Minimum Die Size
• Effective Base Ballasting for Maxi-
mum Gain
• 150 mm Wafers
• High-Q Passives
• NiCr Thin Film Resistors
• High Value Capacitors & Stacked
Capacitors
• Backside Vias Optional
• Validated Models and Design
Support
Applications
• Power Amplifiers
• Driver Amplifiers
• Wideband, General Purpose
Amplifiers
TriQuint Semiconductor
2300 NE Brookwood Pkwy
Hillsboro, Oregon 97124
Semiconductors for Communications
www.triquint.com
Page 1 of 6; Rev 1.1 2/8/2005
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