TQ8223 Datasheet, PDF (1/5 Pages) TriQuint Semiconductor – Device Qualification

TQS Reliability Report # 00-08
TQ8223
Device Qualification
Abstract
This report summarizes the reliability testing that has been performed to qualify the TQ8223
product. The SC5068 is a Superset of the TQ8223 and was previously qualified. The TQ8213,
which is also packaged in a 208 BGA, was used as an additional lot for dimensional qualification.
TQ8223 and SC5068
Both of these parts are fabricated on TriQuint's 0.6µm E/D MESFET GaAs process and are
packaged in a 208 BGA package. Tests, test sample size and failure criteria were defined from
TriQuint’s Specification REL.021 (Policy and Procedure for Reliability Qualifications of ICs). Tests
outlined in this procedure follow the JEDEC Standard Number 26-A or MIL-STD-883 when
applicable.
For further information please contact:
TriQuint Semiconductor
2300 N.E. Brookwood Parkway
Hillsboro, OR 97124
Phone: [phone]
FAX: [phone]
Reliability Test Report
08/01/00