TC1985 Datasheet, PDF (4/4 Pages) Transcom, Inc. – 29 - 36 GHz 2W PA MMIC

ASSEMBLY DIAGRAM
To Vd
10 mil Ag Ribbon
190pF x 4
TC1985
PRE.1_06/21/2006
Note:
1. Using 1mil Au wire.
2. Substrate Material : Al2O3
RF IN
3. Substrate Thickness : 10 mil
RF OUT
To Vg
190pF x 4
RIB : 130 x 280 x 8 mil
10 mil Ag Ribbon
TRANSCOM, INC., 90 Dasoong 7^th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: [phone]
Fax: [phone]
P4/4