TC3741 Datasheet, PDF (2/2 Pages) Transcom, Inc. – 9.5 – 10.5 GHz 2W Single Bias MMIC

Evaluation Board
PCB Material: RO4003
ER = 3.38
Thickness = 20 mil
Unit: mil
* DXF file of the PCB can be downloaded
from our web-site at
www.transcominc.com.tw
* Application Notes:
For better heat sinking and grounding,
it's recommended to have the via holes
beneath TC3741 filled with solder and
have two screws installed on required
heat sink plate besides TC3741 on the
PCB area.
TC3741
REV0_20070111
Diode, D1
Vd1
C4, ^C3,
C5, _0.1uF 1000pF
10uF
C6,
1000pF
Vd2
ATC 0.7pF
C1
TC3741
YYWW
R1
12ohm
C2
ATC 1pF
386-350019-002
T5+T6_
9~11GHz_V1
Evaluation Board Parts List
Qty Part Type Reference Designator Description
Manufacturer Part Number
1 Capacitor
C1
Chip CAP (0805) 0.7PF±0.1PF
ATC
600F0R7BT
1 Capacitor
C2
Chip CAP (0805) 1.0PF±0.1PF
ATC
600F1R0BT
2 Capacitor
C3, C6
Chip CAP (0603) 1000PF±10%
Murata GRM39X7R102K50V
1 Capacitor
C4
Chip CAP (0603) 0.1µF±20%
Murata GRM39Y5V104Z25V
1 Capacitor
C5
Chip CAP (1210) 10µF±20% or
Chip CAP (1206) 10µF±20%
Murata
GRM42-6Y5V106Z25V or
GRM31CF5E106ZA01L
1
Diode
D1
Diode, 400V, 1A (SOD-123)
1 Resistor
R1
Chip resistor (0603) 12Ω±5%
Connection Diagram and PIN Descriptions
Physical Dimensions (Unit:inchs)
TRANSCOM, INC., 90 Dasoong 7^th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: [phone]
Fax: [phone]
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