TC3341 Datasheet, PDF (2/3 Pages) Transcom, Inc. – 3.3 - 3.7 GHz 2W MMIC

TC3341
Absolute Maximum Ratings
REV2_20050418
Symbol
Parameter/Conditions
V_dd Drain-Source Voltage
I_dd Total Drain Current
P_in RF Input Power
P_t Power Dissipation
T_ch Operating Channel Temperature
T_STG Storage Temperature
TEST CIRCUITS
Min.
-65
Max.
12
2200
10
12
175
175
Units
Volts
mA
dBm
W
°C
°C
Note:
1.This GaAs MMIC is susceptible to damage from Electrostatic
Discharge. Proper precautions should be used when handling
these devices.
2.Specifications subject to change without notice.
Evaluation Board Schematic
EVALUATION BOARD
PCB Material: RO4003
ER = 3.38
Thickness = 20 mil
Unit: mil
* DXF file of the PCB can be downloaded from our
web-site at www.transcominc.com.tw
* Application Notes:
For better heat sinking and grounding, it's recommended
to have the via holes beneath TC3341 filled with solder
and have two screws installed on required heat sink plate
besides TC3341 on the PCB area.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: [phone]
Fax: [phone]
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