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TC3331 Datasheet, PDF (2/3 Pages) Transcom, Inc. – 3.3 - 3.7 GHz 1W MMIC
TC3331
REV5_20060516
Absolute Maximum Ratings
Symbol
Parameter/Conditions
Min. Max. Units Note:
Vdd Drain-Source Voltage
12 Volts 1.This GaAs MMIC is susceptible to damage from Electrostatic
Idd Total Drain Current
2200 mA
Discharge. Proper precautions should be used when handling
Pin RF Input Power
7
dBm
these devices.
Pt Power Dissipation
9
W
2.Specifications subject to change without notice.
Tch Operating Channel Temperature
175
°C
TSTG Storage Temperature
-65
175
°C
TEST CIRCUITS
Evaluation Board Schematic
EVALUATION BOARD
PCB Material: RO4003
ER = 3.38
Thickness = 20 mil
Unit: mil
! DXF file of the PCB can be downloaded
from our web-site
at www.transcominc.com.tw
! Application Notes:
For better heat sinking and grounding,
it's recommended to have the via holes
beneath TC3331 filled with solder and
have two screws installed on required
heat sink plate besides TC3331 on the
PCB area.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
P2/3