TC3133 Datasheet, PDF (2/3 Pages) Transcom, Inc. – 2.4 GHz 1W MMIC

TEST CIRCUITS
Evaluation Board Schematic
TC3133
REV2_20031121
EVALUATION BOARD
PCB Material: FR4
ER = 4.6
Thickness = 31 mil
Unit: mil
* DXF file of the PCB can be downloaded
from our web-site at
www.transcominc.com.tw
* Application Notes:
For better heat sinking and
grounding, it's recommended to have the
via holes beneath TC3133 filled with
solder and have two screws installed on
required heat sink plate besides TC3133
on the PCB area.
TRANSCOM, INC., 90 Dasoong 7^th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County,Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: [phone]
Fax: [phone]
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