TLP292 Datasheet, PDF (9/11 Pages) Toshiba Semiconductor – Programmable Controllers AC/DC-Input Module Hybrid ICs

TLP292
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device
temperature as much as possible by observing the following conditions.
1) Using solder reflow
∙Temperature profile example of lead (Pb) solder
(°C
) 24
This profile is based on the device’s
maximum heat resistance guaranteed
0
value.
21
Set the preheat temperature/heating
0
temperature to the optimum temperature
corresponding to the solder paste
16
type used by the customer within the
014
described profile.
0
60 to 120s
Less than
30s
Time
(s
∙Temperature profile example of using lead (Pb)-free solder
(°C)
260
230
190
180
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
60 to 120s
30 to 50s
Time
(s)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2
weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
･Please preheat it at 150°C between 60 and 120 seconds.
･Complete soldering within 10 seconds below 260°C.
ï½¥Flow soldering must be performed once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
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2013-09-12